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High Density 10G EPON OLT Chassis 128×EPON 96×GE For Telecommunication S8600-16

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High Density 10G EPON OLT Chassis 128×EPON 96×GE For Telecommunication S8600-16

Model Number : S8600-16
Place of Origin : China
Brand Name : GCOM
Certification : CE, FC, UL, CCC
MOQ : 1 pcs
Price : Negotiable
Delivery Time : 15 working days
Payment Terms : T/T, L/C
Supply Ability : 1000 pcs/ month
Backplane capacity : >6.4Tbps
Switching capacity : 3.2Tbps
Throughput(IPv4/IPv6) : 2860Mpps
Number of slots : 18
Number of service board slots : 16
EPON : 128*EPON,96*GE
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High Density 10G EPON OLT Chassis 128×EPON 96×GE For Telecommunication S8600-16


Overview

S8600 series are designed by G-COM for high-density access switching integrated platform which combine multi-service and high-density 10G switching requirement. As the new generation of smart equipments for the telecommunications integrated access network, it could build EPON/GPON/10GE/10GEPON general platform and have the features of small size, huge capacity.


Product Specification


Item

S8600-04

S8600-08

S8600-16

Backplane capacity>1.6Tbps>3.2Tbps>6.4Tbps
Switching capacity960Gbps1.6Tbps3.2Tbps
Throughput(IPv4/IPv6)720Mpps1440Mpps2860Mpps
Number of slots61018
Number of service board slots4816
Service portEPON32*EPON,24*GE64*EPON,48*GE128*EPON,96*GE
GPON32*GPON,32*GE64*GPON,64*GE128*GPON,128*GE
SWITCH96*GE,48*10GE192*GE,96*10GE384*GE,192*10GE
Redundancy design

1+1 power redundancy

1+1 main control redundancy

1+1 power redundancy

1+1 main control redundancy

2+2 power redundancy

1+1 main control redundancy

Power supply

AC:90~260V,50~60Hz;

DC:-36V~-72V;

Power consumption≤300W≤680W≤1200W

Outline dimensions

(mm) (W*D*H)

442mm×176mm×420mm442mm×310mm×420mm442mm×664mm×420mm
Weight (in maximum configuration)≤15kg≤25kg≤45kg

Environmental

parameter

Working temperature:0°C~40°C

Storage temperature:-40°C~70°C

Relative humidity:10%~90%,no condensing


Product Tags:

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